ISSN 2394-5125
 

Research Article 


DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION

Jaswinder Singh, Rajesh Kumar, Prateek Srivastava.

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  • Abstract
    Nowadays, cooling applications in the area of electronic instruments such as heat sinks are
    widely used and efficient cooling can enhance the performance of the electronic instruments. The heat sink used
    in this study is micro-channels made up of copper substrate through which liquid is passed for removing the heat
    of the electronic components. For maintaining the volumetric flow rate of cooling liquid through the Micro
    channels as per the required cooling rates, a certain pressure gradient is required to be maintained which
    depends upon several factors including the friction and roughness in the Micro channels . Therefore, the surface
    roughness of Micro channels in heat sinks should be as least as possible. In the present work, micro-channels
    are fabricated in the copper substrate using Wire-EDM. Three input parameters (peak current ranges 100 to 200
    Ampere, on-time pulses range 105 to 115 μsec and off-time pulse rages 25 to 45 μsec) of Wire EDM are varied
    and found two output responses (material removal rate and surface roughness). Further input and output
    parameters are correlated by using Response Surface Methodology (RSM). In this paper GA and TLBO
    algorithm is used for manufacturing tolerances and optimal selection of design to obtain the global optimal
    solution. The mathematical models obtained by regression analysis are used for optimizing the parameters. The
    surface roughness is observed 1.1819μ and 1.1812μ by using GA and TLBO, respectively and the material
    removal rate obtained is 6.73865 mm3/min and 6.743737 mm3/min, respectively. Subsequently, the least
    surface roughness and higher material removal rate values are reported as 2.64246μm and 4.1259 mm3/min,
    respectively.

    Key words: Wire EDM, Optimization, Genetic Algorithm, Teaching Learning Based Optimization


     
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    How to Cite this Article
    Pubmed Style

    Singh J, Kumar R, Srivastava P. DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. JCR. 2020; 7(19): 247-254. doi:10.31838/jcr.07.19.27


    Web Style

    Singh J, Kumar R, Srivastava P. DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. http://www.jcreview.com/?mno=102080 [Access: September 14, 2020]. doi:10.31838/jcr.07.19.27


    AMA (American Medical Association) Style

    Singh J, Kumar R, Srivastava P. DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. JCR. 2020; 7(19): 247-254. doi:10.31838/jcr.07.19.27



    Vancouver/ICMJE Style

    Singh J, Kumar R, Srivastava P. DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. JCR. (2020), [cited September 14, 2020]; 7(19): 247-254. doi:10.31838/jcr.07.19.27



    Harvard Style

    Singh, J., Kumar, . R. & Srivastava, . P. (2020) DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. JCR, 7 (19), 247-254. doi:10.31838/jcr.07.19.27



    Turabian Style

    Singh, Jaswinder, Rajesh Kumar, and Prateek Srivastava. 2020. DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. Journal of Critical Reviews, 7 (19), 247-254. doi:10.31838/jcr.07.19.27



    Chicago Style

    Singh, Jaswinder, Rajesh Kumar, and Prateek Srivastava. "DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION." Journal of Critical Reviews 7 (2020), 247-254. doi:10.31838/jcr.07.19.27



    MLA (The Modern Language Association) Style

    Singh, Jaswinder, Rajesh Kumar, and Prateek Srivastava. "DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION." Journal of Critical Reviews 7.19 (2020), 247-254. Print. doi:10.31838/jcr.07.19.27



    APA (American Psychological Association) Style

    Singh, J., Kumar, . R. & Srivastava, . P. (2020) DESIGN OPTIMIZATION OF A MICROCHANNEL ON COPPER SUBSTRATE USING WIRE-EDM FOR VLSI APPLICATION. Journal of Critical Reviews, 7 (19), 247-254. doi:10.31838/jcr.07.19.27